Radeon HD 3850 X2

Manufacturer:AMD
Series:HD 3xxx (Radeon R600)
Codename:RV670 PRO
Architecture:TeraScale 1
Release date:2008. April 04.
Die count:2
https://gamesystemrequirements.com/
Die size:2x 192 mm2
Fab:55 nm
Transistors:2x 666 millions
Bus interface:PCI-E 2.0 x16

Clock rates

Core clock:669 MHz
Memory clock:828 MHz
Effective memory clock (DDR):6624 MHz

Memory

Memory size:2x 512 MB
Memory bus type:GDDR3
Memory bus width:2x 256 bit
Memory bandwidth (maximum):2x 53 GB/s

Core units

Unified shader units:2x 320
Texture mapping units (TMU):
https://gamesystemrequirements.com/
2x 16
Render output units (ROP):2x 16
Compute units:2x 4

Supported Technologies:

DirectX:10.1
OpenGL:3.3
OpenCL:1.0

Performance

Pixel fillrate:2x 10.7 (GP/s)
Texture fillrate:
https://gamesystemrequirements.com/
2x 10.7 (GT/s)
Thermal Design Power (TDP,Max):140 W
Release price (USD):350 USD
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