Radeon HD 3870 X2

Manufacturer:AMD
Series:HD 3xxx (Radeon R600)
Codename:R680
Architecture:TeraScale 1
Release date:2008. January 26.
Die count:2
https://gamesystemrequirements.com/
Die size:2x 192 mm2
Fab:55 nm
Transistors:2x 666 millions
Bus interface:PCI-E 2.0 x16

Clock rates

Core clock:825 MHz
Memory clock:900 MHz
Effective memory clock (DDR):7200 MHz

Memory

Memory size:2x 512 MB
Memory bus type:GDDR4
Memory bus width:2x 256 bit
Memory bandwidth (maximum):2x 57.6 GB/s

Core units

Unified shader units:2x 320
Texture mapping units (TMU):2x 16
Render output units (ROP):2x 16
Compute units:2x 4

Supported Technologies:

DirectX:10.1
OpenGL:3.3
OpenCL:1.0

Performance

Pixel fillrate:2x 13.2 (GP/s)
Texture fillrate:2x 13.2 (GT/s)
Thermal Design Power (TDP,Max):165 W
Release price (USD):450 USD
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