Radeon 530X

Manufacturer:AMD
Series:Rx M500
Codename:Meso
Architecture:GCN 1
Release date:2017. April 18.
Die count:1
Die size:77 mm2
Fab:28 nm
Transistors:1040 millions
Bus interface:PCI-E 3.0 x16

Clock rates

Core clock:730 MHz
Core clock (Boost):1021 MHz
Memory clock:900 MHz
Effective memory clock (DDR):7200 MHz

Memory

Memory size:2048 MB
Memory bus type:
https://gamesystemrequirements.com/
DDR3
Memory bus width:128 bit
Memory bandwidth (maximum):28.8 GB/s

Core units

Unified shader units:384
Texture mapping units (TMU):24
Render output units (ROP):8
Compute units:6

Supported Technologies:

DirectX:12
OpenGL:4.5
OpenCL:2.0

Performance

Pixel fillrate:8.168 (GP/s)
Texture fillrate:24.5 (GT/s)
Thermal Design Power (TDP,Max):50 W
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